Apple Vision Pro is set to be equipped with a new specialized Dynamic Random Access Memory (DRAM) module enabling the R1 chip to process input data from the headset’s dozen cameras and sensors faster than the blink of an eye. The new DRAM will exclusively be supplied by Korea’s SK hynix, according to a new report by The Korea Herald.
The report delves deeper into the new memory’s architecture including its specifications and manufacturing method. The new DRAM module supports bandwidth speeds of up to 1 gigabit, with the number of input and output pins reportedly increasing by eight times compared to standard DRAM chips in a bid to minimize latency as much as possible. This architecture is otherwise referred to as Low Latency Wide I/O.
The new memory sports a new packaging method when assembled on Vision Pro’s R1 chip, adds the report. The special packaging technique – known as Fan-Out Wafer Level Packaging – allows the DRAM module to be directly connected to the R1 chip as a single consolidated unit. According to the report, the purported advancements with the R1 chip’s DRAM allow it to double its data processing speeds, achieving an effectively lag-free experience when using Vision Pro.
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The R1 chip is one of many new innovations that Apple is touting with its new Vision Pro headset, which the company revealed last month at WWDC 2023. R1 is responsible for processing all real-time data from the headset’s dozen cameras, five 3D sensors, and six microphones, powering Vision Pro’s advanced head, hand, and eye-tracking capabilities. The chip also streams new images to the headset’s displays within 12 milliseconds which is eight times faster than a typical eye blink.
Apple Vision Pro is set to go on sale early next year initially in the United States starting at $3,499. The company plans to introduce an appointment-only purchasing experience for Vision Pro, and availability could expand to the United Kingdom and Canada by the end of 2024.
